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GT830 Ceramic Die Bonding

  • GT830 Ceramic Die Bonding
GT830 Ceramic Die Bonding

GT830 Ceramic Die Bonding

  • Product description: Automatic Die bonding system, high efficiency, high precision, CCD detection and positioning
  • INQUIRY
  • Nitrogen oven
  • 6inch, 8inch wafer handling
  • UPH>20K/Hour
  • MTBA>30min,MTBF>100hour
  • Power: 220V@30KW
  • Nitrogen: 15m3/hr,@3kg/cm2
  • Gas pressure: 5kg/cm2

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